Heat-Sensitive Product Soldering

Pulsed-Light Soldering for Heat-Sensitive Products in Seconds – Not Minutes!

PulseForge® Soldering enables the soldering of low-cost, temperature sensitive substrates such as paper and PEN or low-temp components, with standard lead-free solder pastes in seconds.

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New Technology

A Soldering Solution using High Intensity Flashes of Light

Conventional soldering solutions in electronics manufacturing can be slow, damaging, and inflexible, allowing limited materials and design choices. Powerful and configurable, PulseForge Soldering’s high-intensity pulsed-light solution erases those limitations – without damaging previously off-limits temperature-sensitive components and substrates.

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Upwards of 85% Less Energy Consumption*

PulseForge Soldering Efficiency Video Image

*Represents a specific, typical use case

The Beginning
We evolved our PulseForge curing tools into a new toolset that preferentially heats the solder, not temperature-sensitive substrates and components.
How It Works
Millisecond heating and cooling allows for replacing expensive substrates, such as ceramic, with inexpensive substrates like paper – all while processing with off-the-shelf SAC305. Further reduce costs with no tool warm-up, easy on-off operation, and no thermal soak time for parts or fixtures. And, with its compact design, PulseForge Soldering tools have a small production floor footprint.
Superior Technology
PulseForge Soldering delivers controlled IMC formation with wetted, low-void solder joints, and component self-realignment – even with SAC305, while ultra-fast thermal processing deliberately creates a temperature difference between solder and substrate.

Improved Performance

Soldering with high intensity pulses of light with PulseForge tools – PulseForge has rewritten the design rules that govern the design and production of electronic devices.

Efficient
Efficient

Enables the use of standard lead-free solder pastes on temperature sensitive substrates.

Flexible
Flexible

Multiple component types requiring different levels of heat can be soldered simultaneously.

Rapid
Rapid

Processing is much faster than conventional reflow soldering and is roll-to-roll compatible.