Curing and Sintering

Cure on Heat-Sensitive Substrates in Seconds, not Minutes!

PulseForge Digital Thermal Processing™ provides curing and sintering of thin films at high temperatures on low-cost, temperature-sensitive substrates, including paper and PEN.

Improving Manufacturing

Why It Matters

Because high throughput, sustainability, and design options in manufacturing matter to you. But conventional solutions are limiting:
Curing and Sintering - Antenna on plastic substrate
Curing & sintering circuits on 3-D globe
Tracking device included with new shirt


Ovens are slow with lengthy idle warm up and cool down, return low throughput, and have high energy demands

Sustained Heat

Sustained heat of ovens damages heat-sensitive substrates, limiting design and substrate options



Substrate and design limitations


Lasers offer only one-at-a-time processing

Flexible electronic device on a ladies wrist

Photonic Curing and Sintering

Why We’re Different

In the manufacture of printed, flexible electronics, PulseForge Digital Thermal Processing™ cures and sinters onto inexpensive, flexible substrates – without damage!

And because PulseForge provides curing and sintering of thin films at high temperatures on heat-sensitive substrates, it is the ideal digital thermal process for roll-to-roll processing on polymer and paper.

Growing Application Demands

Layers in devices require versatile thermal processing. Curing and sintering with PulseForge’s Digital Thermal Processing™ is uniquely suited for this manufacturing challenge in next-gen printed electronics:

PulseForge Digital Thermal Processing™ is a hyper-fast, reliable, and transformative curing process, exceeding the demands of design and production in printed electronics manufacturing.
Curing and Sintering - circuit on plastic film attached to a box for tracking

The History of PulseForge

How a Camera Flash Changed the World of Printed Electronics