Digital Thermal Processing™ for Debonding
Debond without ash or chemicals
High throughput, low-stress, low-residue, room temperature debonding
Our debonding tools offer ash- free wafer separation with less contaminants and lower cost compared to lasers. Our soldering tools offer on- wafer bumping at a fraction of the time and thermal budget so sensitive architectures don’t get damaged. Plus, explore our tools for unique cleaning solutions for ultra-fine-pitch features, dehydrogenation, and even novel TFT designs.