News & Media
Argonne and PulseForge Advance Solid-State Electrolyte Manufacturing in Phase 2 CRADA
PulseForge and Argonne National Laboratory launch phase 2 of their Cooperative Research and Development Agreement (CRADA), funded by the U.S. Department of Energy’s Technology Commercialization Fund. This effort builds on their 2024 R&D 100 Award–winning phase 1 work on Solid-State Electrolyte (SSE) synthesis for next-generation batteries and electrolyzers. In phase 2, the team will focus on commercializing the technology by combining Argonne’s development expertise with PulseForge’s materials processing capabilities.
PulseForge Achieves Breakthrough in Ultra-Thin Wafer Processing, Demonstrating Photonic Debonding at less than 10-micron (µm) Silicon
PulseForge, Inc., a leader in advanced electronics manufacturing solutions, today announced a major breakthrough in semiconductor manufacturing: successful photonic debonding of next-generation memory architectures fabricated on ultra-thin silicon wafers below 10 µm. This milestone was achieved in collaboration with a leading Korean memory manufacturer.
PulseForge makes major breakthrough which allows flux-less soldering in an ambient environment
PulseForge, Inc. (PFI), the inventors of Photonic Soldering technology, today announced a major breakthrough enabling high temperature solder alloy reflow in ambient atmosphere without the use of active flux. This advancement constitutes a critical milestone for next generation electronics manufacturing, providing a cleaner, faster, and more cost effective alternative to traditional soldering methods.
PulseForge Announces Availability of PD700 SA – A Semi-Automated Photonic Debonding Tool Optimized for Large-Panel Advanced Packaging
PulseForge, Inc., the exclusive provider of photonic debonding technology, today announced the release and commercial availability of the PD700 SA, a semi-automated photonic debonding tool engineered specifically for large-panel-level packaging semiconductor manufacturing. The new system supports substrate sizes up to 700 mm x 700 mm.
Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging
Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive the adoption of photonic debonding into high-volume manufacturing, offering a high-throughput, low-stress, and industry’s best cost-effective solution for temporary bonding and debonding of ultra-thin wafers.
PulseForge Achieves Record Photonic Debonding Orders in Q1 2025, Signaling Market Acceleration
PulseForge, Inc., a global leader in high-intensity pulsed-light systems for semiconductor manufacturing, today announced a record volume of photonic debonding equipment orders in the first quarter of 2025. This milestone marks a significant inflection point for the industry, reinforcing the growing demand for advanced packaging technologies, particularly in 2.5D/3D integration, AI processors, high-bandwidth memory (HBM) and neuroelectronics applications.