News & Media
PulseForge and Argonne National Laboratory Win R&D100 Award for Breakthrough in Solid-State Lithium Battery Manufacturing
PulseForge, in collaboration with Argonne National Laboratory, has been honored with an R&D100 Award for their innovative work in advancing solid-state lithium battery technology.
PulseForge and Global ZEUS Announce Strategic Partnership to Deliver Automated Photonic Debonding Tools for South Korea
PulseForge, an industry pioneer in advanced semiconductor solutions, proudly announces a strategic partnership with Global ZEUS, a renowned provider of advanced semiconductor processing solutions. This collaboration aims to deliver fully automated photonic debonding tools tailored to the South Korean semiconductor market, enhancing efficiency and cost-effectiveness.
PulseForge Inc. Forms Strategic Partnership with Electronic Scientific Engineering Limited (ESE) to Expand Presence in China
PulseForge Inc., a leading innovator in electronics manufacturing solutions, renowned for its game-changing photonic soldering and photonic curing technologies, is excited to announce a strategic partnership with Electronic Scientific Engineering Limited (ESE). ESE will serve as PulseForge’s exclusive distributor in China for PulseForge products addressing soldering and curing markets, expanding the reach of PulseForge’s cutting-edge solutions in this key market.
Adeia Selects PulseForge Photonic Debonding Equipment for Advanced Semiconductor Applications
Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry, has chosen PulseForge equipment for advanced heterogeneous integration in semiconductors. The photonic debonding tool was installed at Adeia’s San Jose, CA, facility.
NovaCentrix and PulseForge Showcase Breakthrough in Flexible Hybrid Electronics at ICEP 2024
NovaCentrix, a global leader in printed electronics materials such as conductive inks, has collaborated with PulseForge, a pioneer in advanced thermal processing solutions, to present groundbreaking advancements in flexible hybrid electronics (FHE). This collaborative effort was highlighted at the International Conference on Electronics Packaging (ICEP) held in Toyama, Japan from April 17-20, 2024.
PulseForge and Indium Corporation Present Joint Study on Optimizing Photonic Soldering Processes at IPC APEX 2024
PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented exciting findings from their collaborative research at the 2024 IPC APEX Expo in Anaheim, California.