News & Media

A research article was published highlighting the use of a PulseForge Photonic Sintering tool to prepare various Bismuth Oxide and related Bismuth compounds. These materials are very useful as photocatalysts that use sunlight to convert CO2 to CO and CH4. They also may be the key to lead-free highly stable next generation high-performance Perovskite solar cells. The work, done at the Hebrew University in Israel using a PulseForge system, is noteworthy of being added to the PulseForge ‘Top 10’ application list.

PulseForge and Argonne National Laboratory launch phase 2 of their Cooperative Research and Development Agreement (CRADA), funded by the U.S. Department of Energy’s Technology Commercialization Fund. This effort builds on their 2024 R&D 100 Award–winning phase 1 work on Solid-State Electrolyte (SSE) synthesis for next-generation batteries and electrolyzers. In phase 2, the team will focus on commercializing the technology by combining Argonne’s development expertise with PulseForge’s materials processing capabilities.

PulseForge, Inc., a leader in advanced electronics manufacturing solutions, today announced a major breakthrough in semiconductor manufacturing: successful photonic debonding of next-generation memory architectures fabricated on ultra-thin silicon wafers below 10 µm. This milestone was achieved in collaboration with a leading Korean memory manufacturer.

PulseForge, Inc. (PFI), the inventors of Photonic Soldering technology, today announced a major breakthrough enabling high temperature solder alloy reflow in ambient atmosphere without the use of active flux. This advancement constitutes a critical milestone for next generation electronics manufacturing, providing a cleaner, faster, and more cost effective alternative to traditional soldering methods.

PulseForge, Inc., the exclusive provider of photonic debonding technology, today announced the release and commercial availability of the PD700 SA, a semi-automated photonic debonding tool engineered specifically for large-panel-level packaging semiconductor manufacturing. The new system supports substrate sizes up to 700 mm x 700 mm.

Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive the adoption of photonic debonding into high-volume manufacturing, offering a high-throughput, low-stress, and industry’s best cost-effective solution for temporary bonding and debonding of ultra-thin wafers.