PulseForge PD300 SA

Clean and cost-effective debonding solution
Semi-automatic PD300SA
PulseForge Photonic Debonding Video
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Lower TCO by 30% or more

Cleaner process – no ash or residue

Compatible with warped substrates

Configurable for different wafer sizes

Fully automated x-y stage

Minimum of 30% TCO Reduction

The PulseForge PD300 SA is a semi-automated system for debonding temporarily bonded wafer pairs. The PulseForge patented photonic debonding process utilizes a high-intensity flash lamp in conjunction with our proprietary, reusable light-absorbing layer carriers. The solution delivers a minimum 30% reduction in the total cost of ownership (TCO) and provides a clean, zero-force carrier separation.

Suitable for both wafer-level and panel-level packaging, the PD300 SA is ideal for low- volume and R&D applications. It can debond warped wafers without expensive warpage adjustment hardware or process changes. This makes the chip-embedded EMC wafers market (Fan-out packages) uniquely suitable for photonic debonding.

Features

Specs and Supporting Information

Lower TCO by 30% or more

Cleaner process – no ash or residue

Compatible with warped substrates

Configurable for different wafer sizes

Fully automated x-y stage

Are you ready to discover the impact of photonic debonding?

PulseForge PD300 SA Isometric view

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October 2-5, 2023

October 9-12, 2023

October 10-12, 2023

November 14-17, 2023

Upcoming Events

Let Us Know If You Would Like To Meet Up

October 2-5, 2023

October 9-12, 2023

October 10-12, 2023

November 14-17, 2023