Semiconductor Processing

Surpass Expectations with Photonic Debonding

Semiconductor Processing Without Ash or Chemicals.

Be at the cutting edge with PulseForge Photonic Debonding

Semiconductor Processing - Scientist holding semiconductor chip

The drive for Moore’s Law is relentless. New technologies throughout the semiconductor manufacturing cycle have to be the answer, and PulseForge delivers. Our debonding technology offers ash-free wafer separation with fewer contaminants and lower costs compared to lasers. Photonic Debonding is also uniquely suited for chip-embedded EMC wafers (fan-out packages) as we are able to debond warped wafers without any hardware or process changes. Our soldering tools offer on-wafer bumping at a fraction of the time and thermal budget so sensitive architectures don’t get damaged. Plus, explore our tools for unique cleaning solutions for ultra-fine-pitch features, dehydrogenation, and even novel TFT designs.

PulseForge Photonic Debonding Video
Play Video about PulseForge Photonic Debonding Video

Design and build better products, while saving the planet.

Let us show you how we can expand the way you think about design and manufacturing, and make your wildest concepts come to life.
PulseForge Invent


Highly configurable for academic budgets and advanced R&D.

PulseForge In-line soldering tool


Powerful and configurable, the In-Line solution erases limitations.

Integrated Thermal Processing - PulseForge Embed Tool


Deploy as an integrated solution into your manufacturing environment.