New Tech for Surpassing Expectations
Debond without ash or chemicals
The drive for Moore’s Law is relentless. New technologies throughout the semiconductor manufacturing cycle have to be the answer, and PulseForge delivers. Our debonding tools offer ash-free wafer separation with less contaminants and lower cost compared to lasers. Our soldering tools offer on-wafer bumping at a fraction of the time and thermal budget so sensitive architectures don’t get damaged. Plus, explore our tools for unique cleaning solutions for ultra-fine-pitch features, dehydrogenation, and even novel TFT designs.