Advanced Soldering
New Technology
An advanced Soldering Solution using High-Intensity Flashes of Light
Conventional soldering solutions in electronics manufacturing can be slow, damaging, and inflexible, allowing limited materials and design choices. Powerful and configurable, PulseForge Digital Thermal Processing’s high-intensity pulsed-light solution erases those limitations – without damaging previously off-limits temperature-sensitive components and substrates.
Higher throughput and reduced carbon footprint? Yes, with PulseForge Digital Thermal Processing In-Line!
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Upwards of 85% Less Energy Consumption*
*Represents a specific, typical use case
The Beginning
We evolved our PulseForge curing tools into a new toolset that preferentially heats the solder, not temperature-sensitive substrates and components.
How It Works
Millisecond heating and cooling allows for replacing expensive substrates, such as ceramic, with inexpensive substrates like paper – all while processing with off-the-shelf SAC305. Further reduce costs with no tool warm-up, easy on-off operation, and no thermal soak time for parts or fixtures. And, with its compact design, PulseForge Digital Thermal Processing tools have a small production floor footprint.
Superior Technology
PulseForge Digital Thermal Processing delivers controlled IMC formation with wetted, low-void solder joints, and component self-realignment – even with SAC305, while ultra-fast thermal processing deliberately creates a temperature difference between solder and substrate.
Improved Performance
Efficient
Enables the use of standard lead-free solder pastes on temperature sensitive substrates.
Flexible
Multiple component types requiring different levels of heat can be soldered simultaneously.
Rapid
Processing is much faster than conventional reflow soldering and is roll-to-roll compatible.
