News & Media

PulseForge, Inc., a global leader in high-intensity pulsed-light systems for semiconductor manufacturing, today announced a record volume of photonic debonding equipment orders in the first quarter of 2025. This milestone marks a significant inflection point for the industry, reinforcing the growing demand for advanced packaging technologies, particularly in 2.5D/3D integration, AI processors, high-bandwidth memory (HBM) and neuroelectronics applications.

Global Zeus, in collaboration with PulseForge, introduces its new Fully-Automated Photonic Debonder for advanced semiconductor manufacturing, enabling the rapid adoption of technology to help drive the growth of AI chips. This state-of-the-art system accelerates the adoption of photonic debonding technology for high volume production, offering manufacturers a high-throughput and cost-effective wafer debonding solution.

Scientech, a leading semiconductor equipment manufacturer, and PulseForge, a pioneer in photonic debonding technology, have joined forces to launch a Fully Automated Photonic Debonding Solution tailored for advanced packaging.

PulseForge, a leading innovator in photonic curing technology, is excited to announce its participation in this year’s NEPCON Asia, where the company will showcase its cutting-edge PulseForge Invent and PulseForge Inline tools for the first time in China. The event will take place in Shenzhen World Exhibition and Convention Center Baoan from November 6-8, 2024.

PulseForge, in collaboration with Argonne National Laboratory, has been honored with an R&D100 Award for their innovative work in advancing solid-state lithium battery technology.

PulseForge, an industry pioneer in advanced semiconductor solutions, proudly announces a strategic partnership with Global ZEUS, a renowned provider of advanced semiconductor processing solutions. This collaboration aims to deliver fully automated photonic debonding tools tailored to the South Korean semiconductor market, enhancing efficiency and cost-effectiveness.