News & Media

Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging

Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive the adoption of photonic debonding into high-volume manufacturing, offering a high-throughput, low-stress, and industry’s best cost-effective solution for temporary bonding and debonding of ultra-thin wafers.

Read More »

PulseForge Achieves Record Photonic Debonding Orders in Q1 2025, Signaling Market Acceleration

PulseForge, Inc., a global leader in high-intensity pulsed-light systems for semiconductor manufacturing, today announced a record volume of photonic debonding equipment orders in the first quarter of 2025. This milestone marks a significant inflection point for the industry, reinforcing the growing demand for advanced packaging technologies, particularly in 2.5D/3D integration, AI processors, high-bandwidth memory (HBM) and neuroelectronics applications.

Read More »

Global Zeus and PulseForge Introduce Fully-Automated Photonic Debonder Ahead of SEMICON Korea 2025

Global Zeus, in collaboration with PulseForge, introduces its new Fully-Automated Photonic Debonder for advanced semiconductor manufacturing, enabling the rapid adoption of technology to help drive the growth of AI chips. This state-of-the-art system accelerates the adoption of photonic debonding technology for high volume production, offering manufacturers a high-throughput and cost-effective wafer debonding solution.

Read More »