PulseForge Soldering In-Line Named Best Product North America
PulseForge today announced that it received a 2021 GLOBAL Technology Award in the category Best Product – North America for its PulseForge In-Line. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.
“We are truly honored to receive this recognition,” said Stan Farnsworth, PulseForge’s Chief Marketing Officer. “Our customers are telling us that the unique soldering reflow capabilities of the PulseForge tool will have a big impact in the EMS/SMT design and manufacturing space. The energy savings alone is substantial and can meaningfully decarbonize electronics production.”
PulseForge’s new In-Line, with proprietary high-intensity thermal technology, reflows a wide range of traditional solders, such as SAC305, in seconds or less. Such fast processing allows commercial packages, including transistors, LEDs, and resistors in traditional sizes to be soldered to heat-sensitive substrates like plastic, films, textiles, and paper, without damaging the substrate. Additionally, temperature-sensitive components such as sensors, batteries, and cameras can be directly soldered without damage. Furthermore, because of the ultra-rapid processing speed, substantial energy savings have been demonstrated versus traditional thermal processing methods.
PulseForge’s high-speed, high-intensity thermal technology makes substrate and component damage during soldering a concern of the past. Product innovators and manufacturers can now utilize flexible, low-cost substrates, and deliver functionality never before possible with conventional oven and laser processing.
In-Line is SMEMA 9851 compliant with high throughput, and available with input and output buffers. Move past conventional, slow, inflexible soldering solutions and take back control of materials and design in electronics manufacturing – without damaging heat-sensitive substrates and components.
The GLOBAL Technology Awards have recognized the very best new innovations in the printed circuit assembly and packaging industries since 2005. The prestigious awards contest has been bringing together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net/awards.
