PulseForge

PulseForge to Showcase Invent and Inline Tools for the First Time at NEPCON Asia

PulseForge, a leading innovator in photonic curing technology, is excited to announce its participation in this year’s NEPCON Asia, where the company will showcase its cutting-edge PulseForge Invent and PulseForge Inline tools for the first time in China. The event will take place in Shenzhen World Exhibition and Convention Center Baoan from November 6-8, 2024.

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PulseForge and Global ZEUS Announce Strategic Partnership to Deliver Automated Photonic Debonding Tools for South Korea

PulseForge, an industry pioneer in advanced semiconductor solutions, proudly announces a strategic partnership with Global ZEUS, a renowned provider of advanced semiconductor processing solutions. This collaboration aims to deliver fully automated photonic debonding tools tailored to the South Korean semiconductor market, enhancing efficiency and cost-effectiveness.

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PulseForge Photonic Soldering Technology

PulseForge Inc. Forms Strategic Partnership with Electronic Scientific Engineering Limited (ESE) to Expand Presence in China

PulseForge Inc., a leading innovator in electronics manufacturing solutions, renowned for its game-changing photonic soldering and photonic curing technologies, is excited to announce a strategic partnership with Electronic Scientific Engineering Limited (ESE). ESE will serve as PulseForge’s exclusive distributor in China for PulseForge products addressing soldering and curing markets, expanding the reach of PulseForge’s cutting-edge solutions in this key market.

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Adeia Selects PulseForge Photonic Debonding Equipment for Advanced Semiconductor Applications

Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry, has chosen PulseForge equipment for advanced heterogeneous integration in semiconductors. The photonic debonding tool was installed at Adeia’s San Jose, CA, facility.

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soldering on temp-sensitive substrates

NovaCentrix and PulseForge Showcase Breakthrough in Flexible Hybrid Electronics at ICEP 2024

NovaCentrix, a global leader in printed electronics materials such as conductive inks, has collaborated with PulseForge, a pioneer in advanced thermal processing solutions, to present groundbreaking advancements in flexible hybrid electronics (FHE). This collaborative effort was highlighted at the International Conference on Electronics Packaging (ICEP) held in Toyama, Japan from April 17-20, 2024.

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Ultra-low residue SIR paste

PulseForge and Indium Corporation Present Joint Study on Optimizing Photonic Soldering Processes at IPC APEX 2024

PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented exciting findings from their collaborative research at the 2024 IPC APEX Expo in Anaheim, California.

PulseForge and Indium Corporation Present Joint Study on Optimizing Photonic Soldering Processes at IPC APEX 2024 Read More »