PulseForge

Scientech, a leading semiconductor equipment manufacturer, and PulseForge, a pioneer in photonic debonding technology, have joined forces to launch a Fully Automated Photonic Debonding Solution tailored for advanced packaging.

PulseForge, a leading innovator in photonic curing technology, is excited to announce its participation in this year’s NEPCON Asia, where the company will showcase its cutting-edge PulseForge Invent and PulseForge Inline tools for the first time in China. The event will take place in Shenzhen World Exhibition and Convention Center Baoan from November 6-8, 2024.

PulseForge, in collaboration with Argonne National Laboratory, has been honored with an R&D100 Award for their innovative work in advancing solid-state lithium battery technology.

PulseForge, an industry pioneer in advanced semiconductor solutions, proudly announces a strategic partnership with Global ZEUS, a renowned provider of advanced semiconductor processing solutions. This collaboration aims to deliver fully automated photonic debonding tools tailored to the South Korean semiconductor market, enhancing efficiency and cost-effectiveness.

PulseForge Inc., a leading innovator in electronics manufacturing solutions, renowned for its game-changing photonic soldering and photonic curing technologies, is excited to announce a strategic partnership with Electronic Scientific Engineering Limited (ESE). ESE will serve as PulseForge’s exclusive distributor in China for PulseForge products addressing soldering and curing markets, expanding the reach of PulseForge’s cutting-edge solutions in this key market.

Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry, has chosen PulseForge equipment for advanced heterogeneous integration in semiconductors. The photonic debonding tool was installed at Adeia’s San Jose, CA, facility.

NovaCentrix, a global leader in printed electronics materials such as conductive inks, has collaborated with PulseForge, a pioneer in advanced thermal processing solutions, to present groundbreaking advancements in flexible hybrid electronics (FHE). This collaborative effort was highlighted at the International Conference on Electronics Packaging (ICEP) held in Toyama, Japan from April 17-20, 2024.

PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented exciting findings from their collaborative research at the 2024 IPC APEX Expo in Anaheim, California.

PulseForge Inc., a pioneer in developing equipment and processes for semiconductor debonding, micro-LED transfer, curing, sintering, and soldering technologies, has announced a strategic partnership with Global Marketing Services (GMS) to serve as its sales agent in India.

PulseForge is thrilled to announce its receipt of the esteemed 2024 3D InCites Technology Enablement Award for its revolutionary Photonic Debonding technology.