PulseForge, Inc. (PFI), the inventors of Photonic Soldering technology, today announced a major breakthrough enabling high temperature solder alloy reflow in ambient atmosphere without the use of active flux. This advancement constitutes a critical milestone for next generation electronics manufacturing, providing a cleaner, faster, and more cost effective alternative to traditional soldering methods.
PulseForge, Inc., the exclusive provider of photonic debonding technology, today announced the release and commercial availability of the PD700 SA, a semi-automated photonic debonding tool engineered specifically for large-panel-level packaging semiconductor manufacturing. The new system supports substrate sizes up to 700 mm x 700 mm.
Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive the adoption of photonic debonding into high-volume manufacturing, offering a high-throughput, low-stress, and industry’s best cost-effective solution for temporary bonding and debonding of ultra-thin wafers.
PulseForge, Inc., a global leader in high-intensity pulsed-light systems for semiconductor manufacturing, today announced a record volume of photonic debonding equipment orders in the first quarter of 2025. This milestone marks a significant inflection point for the industry, reinforcing the growing demand for advanced packaging technologies, particularly in 2.5D/3D integration, AI processors, high-bandwidth memory (HBM) and neuroelectronics applications.
Global Zeus, in collaboration with PulseForge, introduces its new Fully-Automated Photonic Debonder for advanced semiconductor manufacturing, enabling the rapid adoption of technology to help drive the growth of AI chips. This state-of-the-art system accelerates the adoption of photonic debonding technology for high volume production, offering manufacturers a high-throughput and cost-effective wafer debonding solution.
Scientech, a leading semiconductor equipment manufacturer, and PulseForge, a pioneer in photonic debonding technology, have joined forces to launch a Fully Automated Photonic Debonding Solution tailored for advanced packaging.
PulseForge, a leading innovator in photonic curing technology, is excited to announce its participation in this year’s NEPCON Asia, where the company will showcase its cutting-edge PulseForge Invent and PulseForge Inline tools for the first time in China. The event will take place in Shenzhen World Exhibition and Convention Center Baoan from November 6-8, 2024.
PulseForge to Showcase Invent and Inline Tools for the First Time at NEPCON Asia Read More »
PulseForge, in collaboration with Argonne National Laboratory, has been honored with an R&D100 Award for their innovative work in advancing solid-state lithium battery technology.
PulseForge, an industry pioneer in advanced semiconductor solutions, proudly announces a strategic partnership with Global ZEUS, a renowned provider of advanced semiconductor processing solutions. This collaboration aims to deliver fully automated photonic debonding tools tailored to the South Korean semiconductor market, enhancing efficiency and cost-effectiveness.
PulseForge Inc., a leading innovator in electronics manufacturing solutions, renowned for its game-changing photonic soldering and photonic curing technologies, is excited to announce a strategic partnership with Electronic Scientific Engineering Limited (ESE). ESE will serve as PulseForge’s exclusive distributor in China for PulseForge products addressing soldering and curing markets, expanding the reach of PulseForge’s cutting-edge solutions in this key market.