We are thrilled to announce the much-anticipated launch of our revolutionary photonic curing technology for polyimide at the 2nd International Conference on Polymer Science and Engineering.
2023 Polymers Conference and exciting technology launch! Read More »
Dr. Kurt Schroder has been honored with the prestigious “Inventor of the Year” award by the Austin Intellectual Property Law Association.
Dr. Kurt Schroder, AIPLA Inventor of the Year Read More »
PulseForge, Inc. and Teikoku Taping System (TTS), have established a strategic integration partnership to integrate the PulseForge photonic debonding module into a state-of-the-art, fully-automated tool.
PulseForge Inc. and Applied Novel Devices (AND), have joined forces to demonstrate a groundbreaking advancement in the field of power electronics packaging through photonic debonding.
PulseForge, Inc. and Scientech have announced a collaboration to integrate Digital Thermal Processing into Scientech’s semiconductor equipment portfolio.
Dr. Ara Parsekian, Ph.D., our Senior Applications Engineer at PulseForge, discusses the fundamentals of Photonic reflow, which is a rapid, selective, and non-contact thermal process for SMT applications.
SMTA – Photonic Reflow: Process Fundamentals and Best Use Cases Read More »
PulseForge, Inc. and NADA Technologies, Inc. announced today that the companies are collaborating to bring a high-volume, fully-automated solution for debonding to the semiconductor industry.
PulseForge, Inc. and ERS electronic GmbH have announced a strategic alliance to bring a fully-automated photonic debonding solution to the semiconductor industry.
PulseForge, Inc. announces the release of its flagship industrial decontamination system, the Pathogen Decontamination System (PDS).
Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging.