Articles

Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry, has chosen PulseForge equipment for advanced heterogeneous integration in semiconductors. The photonic debonding tool was installed at Adeia’s San Jose, CA, facility.

NovaCentrix, a global leader in printed electronics materials such as conductive inks, has collaborated with PulseForge, a pioneer in advanced thermal processing solutions, to present groundbreaking advancements in flexible hybrid electronics (FHE). This collaborative effort was highlighted at the International Conference on Electronics Packaging (ICEP) held in Toyama, Japan from April 17-20, 2024.

PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented exciting findings from their collaborative research at the 2024 IPC APEX Expo in Anaheim, California.

PulseForge Inc., a pioneer in developing equipment and processes for semiconductor debonding, micro-LED transfer, curing, sintering, and soldering technologies, has announced a strategic partnership with Global Marketing Services (GMS) to serve as its sales agent in India.

PulseForge is thrilled to announce its receipt of the esteemed 2024 3D InCites Technology Enablement Award for its revolutionary Photonic Debonding technology.

PulseForge, an industry pioneer specializing in advanced solutions for the semiconductor sector, is spearheading efforts to drive the global adoption of 2D materials in devices and packages using its photonic debonding technology for successful 2D material transfer.

The long-standing collaboration between Optomec and NovaCentrix has redefined the landscape of printed electronics by harnessing the combined expertise of both companies to deliver cutting-edge solutions across a diverse spectrum of industries.

Auburn’s in-depth review of PulseForge Photonic Decontamination Technology offers insight into a novel methodology to attain reductions in pathogenic microorganisms marking a significant milestone in the evolution of food safety practices.

PulseForge and nScrypt have unveiled a new comprehensive turnkey solution. This solution will be able to produce 3D structures, cure both functional and non-functional materials using photonic curing, proficiently dispense solder paste, and accomplish successful soldering of surface mount components using photonic soldering.

We are thrilled to announce the much-anticipated launch of our revolutionary photonic curing technology for polyimide at the 2nd International Conference on Polymer Science and Engineering.